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15 Nov 2021

New TI Biomedical Engineering and Sciences Building will advance patient care

A collaboration between The University of Texas at Dallas, UT Southwestern Medical Center and TI will take biomedical engineering and research to new levels.

10 Nov 2021

Q&A: How low quiescent current is transforming battery-powered devices

Low quiescent current is extending battery life in devices ranging from smart watches to smoke detectors.

05 Oct 2021

ADAS: The technology driving automotive safety forward

Advanced driver assistance systems make cars safer and smarter, helping carmakers achieve their vision for a collision-free future.

24 Aug 2021

Meet the risk-buster: How functional safety helps keep you safe

Whether it’s preventing systematic failures or anticipating and mitigating future risk, functional safety has changed the way engineers think about designing systems.

10 Aug 2021

From the rice fields to technology leadership

Since leaving the rice fields as a young man and advancing his career, Jinrong Qian has been driven to be creative, solve problems, and do the right thing for customers and our company.

03 Aug 2021

Q&A: The technology making real-time processing easy and affordable

As the need grows for real-time control, intelligence and communications at the edge of electronic systems, high-performance MCUs are now providing a simple, cost-effective solution.

22 Jul 2021

Dan Rembold’s problem-solving skills put him on the road to cancer recovery

Dan Rembold had 72 hours to live. And he didn't know it yet. After a battery of tests, doctors identified his mysterious illness: an aggressive blood cancer. A tough treatment saved his life. Now he's planning to cycle across the United States to raise awareness about cancer research.

20 Jul 2021

Bringing high-quality 3D printing to your desktop

TI DLP® technology is making high-quality 3D printing more affordable for small business owners, hobbyists and others.

24 Jun 2021

Developing the first ICs to orbit Earth

For Charles “Bob” Cook, a project assigned by Jack Kilby led to the development of the first integrated circuits to ever orbit the Earth – and a foundation for future space electronics.

01 Jun 2021

The power of packaging

Innovations in semiconductor packaging are helping meet demands for smaller, faster and more reliable chips that deliver high performance, improved power efficiency and lower costs.